The mechanized assembly hall of this facility, with an area of 800 square meters, is dedicated to producing CKD (Completely Knocked Down) products. The infrastructure of this hall includes a cleanroom with a 100K standard (upgradeable) and an anti-static floor covering, in line with the current global standards for manufacturing.

The processes within this facility are conducted in a professional manner and comply with the latest regulatory standards. The following processes are currently being implemented:

1. Raw components and circuit boards are initially delivered from the centralized component warehouse located adjacent to the facility. Upon delivery, they undergo Incoming Quality Control (IQC) inspection. Once approved, the components are stored in designated moisture-resistant cabinets, with each component assigned a specific storage address. Semiconductor components, such as ICs, undergo a 48-hour BAKE process in specialized equipment prior to usage.
2. Raw circuit boards for each project are first tested using an ETEST (FLYING PROBE TESTER) device. Subsequently, a unique serial number is laser-engraved on each board using a laser marking machine. Once confirmed, the boards are stored, similar to other components, in the inventory.
3. The programming of each board is carried out offline, based on the product tree and PCB file. After loading the necessary components, the appropriate solder paste is selected for the specific board and its components. The solder paste is placed in the ambient environment at least 4 hours before production and mixed by a mixer device according to the specified time.
4. To manufacture a board, the stencil is loaded into the solder paste printer, and the raw boards are simultaneously loaded into the printer via a loader, enabling the solder paste to be printed onto the raw boards.
5. After solder paste printing, the print quality, including height and volume, is inspected using an SPI (Solder Paste Inspection) machine. The SPI machine records the solder paste printing quality report, including the board’s unique serial number, which can later be provided to customers for analysis.
6. Upon approval from the SPI inspection, the boards proceed to the assembly machine. The components are mounted on the boards according to the pre-planned arrangement, with an assembly capacity of 336,000 components per hour. For example, for a modem board with various components such as chips and ICs totaling 203 pieces, the assembly speed reaches approximately 50,141 components per hour. Subsequently, the assembled boards enter the AOI (Automated Optical Inspection) machine before the oven stage to verify the correctness of the assembly, including component orientation, type, and proper mounting. If any errors occur during component loading or assembly, they are identified by the AOI machine. Once confirmed, the shield installation machine places metal shields and larger packaged components (in roll or tray form) onto the boards at a speed of 28,000 components per hour.
7. Following the assembly stage, the boards enter the oven. The oven is equipped with 18 thermal zones and operates with nitrogen, following a pre-programmed thermal profile based on the solder paste and component requirements.
8. After passing through the reflow oven, the boards undergo final AOI inspection. In this stage, a 3D analysis of the assembled boards is performed, evaluating aspects such as pad-component adhesion, component orientation, and analyzing text on the components. The analysis and assembly report, including adhesive quality, component orientation, and any relevant assembly information, is generated for each board. If the boards contain BGA (Ball Grid Array) components, they are inspected using an X-ray machine. Defective boards are subjected to rework processes within the rework machines and then re-inspected by the AOI machine. If multiple boards are included on a single sheet, they undergo cutting using a cutting machine before being packaged in anti-static nylon bags.