HighPCB upholds the highest standards, strictly adhering to key industry guidelines such as IPC-2221, IPC-A-600, IPC-A-610, IPC CLASS 2, and IPC CLASS 3.
HighPCB mantém os mais altos padrões, seguindo rigorosamente as principais diretrizes da indústria, como IPC-2221, IPC-A-600, IPC-A-610, IPC CLASS 2 e IPC CLASS 3.
Solder Paste Inspection (SPI) is a crucial step in modern PCB assembly, ensuring that solder paste is applied with precision, accuracy, and consistency before components are placed and reflow soldering occurs. Proper solder paste application is essential to the quality and reliability of electronic circuits, as defects at this stage can lead to electrical failures, weak solder joints, and long-term reliability issues.
At HighPCB, we use cutting-edge 3D SPI technology to detect and correct potential defects in solder paste application before component placement, preventing costly rework, product failures, and unnecessary waste. Our approach ensures high-quality, defect-free PCBs that meet the most demanding industry standards.
Solder paste serves as the primary medium for creating strong electrical connections between components and the PCB surface. Even minor inconsistencies in solder paste volume, alignment, or shape can result in severe defects, including:
❌ Open Circuits (Insufficient Solder): Weak joints that can cause electrical failures.
❌ Short Circuits (Excess Solder/Bridging): Unintended electrical connections leading to malfunctions.
❌ Component Misalignment: Poor soldering adhesion due to misplaced paste.
❌ Tombstoning Effect: Uneven solder paste volume causing one end of the component to lift off.
💡 By using advanced SPI systems, we can detect and rectify these issues before assembly, ensuring defect-free PCBs and enhanced long-term performance.
✅ Key Benefits of SPI PCB Assembly at HighPCB
🔹 Early Defect Detection: Identifies errors in solder paste application before assembly, preventing costly failures.
🔹 Cost Reduction: Minimizes waste, rework, and repair costs by catching defects early in the process.
🔹 Higher Production Yields: Ensures a more consistent assembly process with near-zero defects.
🔹 Improved Solder Joint Reliability: Ensures stronger, more durable electrical connections.
🔹 Compliance with Industry Standards: Our SPI process meets IPC-A-610 Class 3, ISO 9001, and ISO 13485 standards, making it suitable for medical, aerospace, and automotive electronics.
🛠️ Step-by-Step SPI PCB Assembly Process at HighPCB
At HighPCB, we follow an industry-leading SPI process to ensure precision, quality, and consistency in every PCB we manufacture.
🔹 Step 1: Solder Paste Printing
We use high-precision stencil printers to deposit solder paste onto PCB pads in a controlled and optimized process.
Factors like paste viscosity, printing pressure, and temperature are carefully adjusted to ensure uniform paste coverage.
🔹 Step 2: 3D SPI Inspection (Solder Paste Inspection)
Real-time scanning with 3D SPI technology captures height, volume, and alignment of solder paste deposits.
The system detects insufficient paste, excess deposition, and misalignment before components are placed.
Advanced algorithms analyze thousands of data points for highly accurate defect detection.
🔹 Step 3: Automatic Quality Control Adjustment
Any defects identified are immediately flagged, allowing for corrective action before component placement.
Machine-learning algorithms fine-tune solder paste application for future production cycles, improving accuracy over time.
🔹 Step 4: Component Placement & Reflow Soldering
After SPI verification, components are placed with high precision using automated pick-and-place systems.
The PCB undergoes controlled reflow soldering, where the solder paste melts and solidifies, forming strong and reliable solder joints.
🔹 Step 5: Final Optical & X-Ray Inspection
After reflow, Automated Optical Inspection (AOI) and X-ray Inspection (AXI) verify solder joints for hidden defects, voids, and misalignments.
This ensures that every PCB we produce meets 100% reliability standards before shipment.
💡 Our multi-layered quality control system (SPI, AOI, and AXI) ensures a defect-free PCB assembly process, minimizing failures and maximizing efficiency.
Common Mistakes in SPI Assembly and How to Avoid Them
SPI is a critical step in PCB assembly, and even minor mistakes can lead to serious manufacturing defects. At HighPCB, we implement advanced quality control measures to eliminate these issues before they affect the final product.
Inconsistent Solder Paste Deposition
Uneven solder paste application leads to poor connectivity and misaligned components. This issue is often caused by improper stencil design, incorrect squeegee pressure, or degraded paste viscosity.
How HighPCB Ensures Accuracy:
High-precision laser-cut stencils with optimized aperture designs.
Automated SPI systems that verify real-time uniform paste application.
Controlled storage and handling to maintain ideal solder paste viscosity.
Incorrect Stencil Alignment
A misaligned stencil can shift solder paste deposits, leading to bridging or insufficient solder on pads.
How HighPCB Prevents Misalignment:
Automated stencil alignment systems ensure precise positioning.
Regular equipment calibration and maintenance to prevent printing errors.
Poor Solder Paste Quality
Using expired or improperly stored solder paste can lead to inconsistencies, voids, and poor wetting, which impact PCB reliability.
How HighPCB Maintains Quality:
Strict monitoring of paste expiration dates.
Controlled storage environments with optimized humidity and temperature settings.
Insufficient or Excessive Paste Volume
Too much solder paste can cause bridging and shorts, while too little paste can lead to weak joints or open circuits.
How HighPCB Achieves Perfect Volume:
SPI inspection systems measure paste height, width, and volume for precise application.
Stencil thickness and printing parameters are fine-tuned for optimal results.
Ignoring SPI Data for Process Optimization
Some manufacturers fail to analyze SPI data, missing opportunities to improve yield and reduce defects.
How HighPCB Optimizes Production:
Continuous analysis of SPI inspection reports to detect and eliminate issues.
Real-time feedback systems that allow immediate corrective action, reducing rework and scrap.
🎯 Why Choose HighPCB for Your PCB Assembly?
At HighPCB, we don’t just assemble PCBs—we ensure they perform flawlessly. Our state-of-the-art SPI process guarantees:
✅ Minimal defects and higher production efficiency.
✅ Enhanced reliability and long-term performance of your electronics.
✅ Compliance with industry-leading standards for medical, aerospace, automotive, and industrial electronics.
If you’re looking for a trusted partner in high-precision PCB assembly, contact HighPCB today!
🔍 The Science Behind SPI – How It Works
🛠️ 3D Solder Paste Inspection (SPI) Technology at HighPCB
We utilize next-generation SPI systems with advanced features, including:
📡 Laser Profiling & Moiré Interferometry – Generates high-resolution 3D images of solder paste height, shape, and volume.
📊 Advanced Machine Vision Algorithms – Detects paste misalignment, excessive volume, and inadequate deposition with micrometer precision.
🧠 Artificial Intelligence & Predictive Analytics – Machine learning improves solder paste application over time, reducing defects across production runs.
📦 Industries We Serve
🔹 Medical Electronics – High-reliability PCBs for life-saving devices.
🔹 Automotive PCBs – Durable, automotive-grade electronics.
🔹 Aerospace & Defense – Mission-critical PCBs for aviation & military applications.
🔹 Industrial Automation – Reliable PCBs for control systems & robotics.
🔹 Consumer & IoT Devices – Flawless PCBs for smart home & wearable technology.
