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In modern electronics manufacturing, the miniaturization and complexity of components demand unparalleled precision. Among the most delicate components are Moisture-Sensitive Devices (MSDs), such as BGAs, QFNs, PLCCs, and some tantalum capacitors. Improper handling of these components can result in catastrophic failures, invisible defects, or even total board malfunction. At HighPCB, we follow industry-leading practices to…

Class 3 electronic assemblies in IPC-610 have the most stringent requirements due to their application in areas where high reliability and performance are critical, such as aerospace, medical devices, and military equipment. The specific requirements for Class 3 electronic assemblies include: 1. Component Placement Components must be accurately placed and aligned according to the design…