Paper-Epoxy Boards That Bridge the Gap Between Ultra-Budget Phenolic and Full Glass-Epoxy FR3 PCB

fr3 pcb price | fr3 pcb material | FR3 PCB

What Is FR-3?

FR-3 is the IPC-4101 /12 laminate that combines a cellulose-paper core with an epoxy resin binder and copper foil on one or both sides.
It delivers better solder-mask adhesion and bond strength than phenolic FR-1/FR-2, yet remains punch-friendly and cost-efficient (≈ 55 % of FR-4).

Property Typical Value* Design Significance
Dielectric constant εr (1 MHz) 4.7 – 4.9 Stable up to ≈ 80 MHz clocks
Loss tangent (1 MHz) ≈ 0.025 Lower loss than phenolic, still budget-friendly
Glass-transition Tg 120 – 135 °C Survives Sn-Pb wave / selective Pb-free ≤ 245 °C
Z-axis CTE (< Tg) 70 – 85 ppm / °C Punch vias ≤ 6:1 AR to avoid barrel cracks
Thermal conductivity ≈ 0.30 W / m·K Manage heat with wider traces or jumpers
UL-94 flame class HB or V-0 (optional) Specify V-0 for appliance safety

*Always confirm the exact datasheet grade for production.

HIGHPCB is one of the largest Epoxy PCB Board and Rigid PCB manufacturing factories in China, click on the link to see more.

Why Choose FR-3?

Better bond strength vs. FR-1/2

Epoxy resin resists delamination, improves solder-mask adhesion.

Selective Pb-free capable

Low-temp BiSnAg or selective hand-reflow at ≤ 245 °C – useful for mixed-SMT designs.

Punchable & V-scorable

Steel-rule punching up to 350 × 450 mm cuts outline + I/O slots in one hit.

Lower εr than phenolic

Cleaner signal edges; reliable up to ~80 MHz digital or 40 kHz PWM drivers.

Moderate cost

Roughly half the raw-laminate price of standard FR-4.

Typical Applications

  • CFL / LED driver boards up to 40 W
  • Microwave-oven, dishwasher & washing-machine controllers
  • Smart plugs, Wi-Fi power meters, low-cost IoT nodes
  • Low-frequency audio amplifiers (≤ 80 kHz)
  • Appliance keypads & capacitive touch PCBs

FR-3 Manufacturing Flow

Step Process Note Key Control
CAM & panelisation Punch map, impedance DRC Min. clearance 0.25 mm
Die-punch / drilling Steel-rule outline; carbide drill < 1 mm ≤ 200 hits per bit
Cu imaging & etch Dry-film 50 µm; alkaline etch Trace / gap ≥ 0.20 mm
Through-hole plating Optional – cost↑; flush rivets common Aspect ratio ≤ 6:1
Solder mask LPI epoxy, UV cure Opening ≥ 0.10 mm
Surface finish OSP / Sn-Pb HASL (≥ 8 µm) ENIG (for selective Pb-free) Wave dwell < 6 s @ 245 °C
Depanelisation Hydraulic punch Burr ≤ 0.05 mm
Electrical test Flying-probe + 250 V HiPot Isolation ≥ 10 MΩ

5 | Design Guidelines (Engineer’s Cheat-Sheet)

  • Layers: 1 layer is standard; simple 2-layer possible with plated vias.
  • Board thickness: 1.0 – 1.6 mm (avoid < 1 mm due to warpage).
  • Copper weight: 35 µm standard; 70 µm for ≥ 2 A traces (add 2 mm / A width).
  • Pads & annular rings: ≥ 0.30 mm; square pads reduce peel-off.
  • Thermal reliefs: 4 spokes, spoke ≥ 0.25 mm.
  • Creepage / clearance: ≥ 2.5 mm for 250 V basic insulation (IEC 60335-1).
  • Selective Pb-free: Keep peak ≤ 245 °C, dwell ≤ 10 s; use BiSnAg paste.

Heat-Management Tip: For TO-220 regulators on FR-3, add a thick-copper jumper or external aluminium slug – k ≈ 0.30 W/m·K limits in-plane spreading.

6 | FR-3 vs. FR-1 / FR-2 / High-Tg FR-4 (Single Layer)

Metric FR-1 FR-2 FR-3 High-Tg FR-4
Relative laminate cost 0.40 0.35 0.55 1.00
Punchability ★★★ ★★★ ★★☆
Pb-free reflow ♦ (≤ 245 °C selective)
Max frequency 30 MHz 30 MHz 80 MHz Multi-GHz
Mechanical strength Low Low-Medium Medium High
Flame rating HB / V-0 HB / V-0 HB / V-0 V-0

♦ = feasible with low-temp solder & brief dwell

Support All Types of PCB Fabrication

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Why Order FR-3 PCBs from HighPCB?

  • Dedicated punch & CNC lines – rapid turn on large appliance panels.
  • Process-controlled Sn-Pb & low-temp Pb-free profiles – no blistering, no delam.
  • 3-day prototype service (single-layer) & 7-day two-layer production.
  • Add-on services: stencil, selective-solder jig, conformal coating, 100 % ICT.

Need a cost-effective epoxy board with better durability than phenolic?
Click for an instant FR-3 quotation from HighPCB and accelerate your next appliance or smart-home design to market!

FAQ

Can FR-3 PCBs support SMT?

Yes. Wave-solder or selective Pb-free ≤ 245 °C handles SOIC, SOT-23, QFPs. Avoid large BGAs; switch to FR-4 for heavy fine-pitch parts.

Is FR-3 more reliable than phenolic boards?

The epoxy binder greatly increases interlaminar adhesion and solder-mask bond, reducing delamination and pad-lift versus FR-1 / FR-2.

What is the largest FR-3 panel HighPCB can produce?

Up to 350 × 450 mm punched, or 400 × 500 mm routed, with ± 0.15 mm dimensional tolerance.

Are FR-3 laminates RoHS compliant?

All FR-3 stock at HighPCB meets RoHS 2 and REACH; halogen-free V-0 grades can be specified.