Paper-Epoxy Boards That Bridge the Gap Between Ultra-Budget Phenolic and Full Glass-Epoxy FR3 PCB

What Is FR-3?
FR-3 is the IPC-4101 /12 laminate that combines a cellulose-paper core with an epoxy resin binder and copper foil on one or both sides.
It delivers better solder-mask adhesion and bond strength than phenolic FR-1/FR-2, yet remains punch-friendly and cost-efficient (≈ 55 % of FR-4).
| Property | Typical Value* | Design Significance |
| Dielectric constant εr (1 MHz) | 4.7 – 4.9 | Stable up to ≈ 80 MHz clocks |
| Loss tangent (1 MHz) | ≈ 0.025 | Lower loss than phenolic, still budget-friendly |
| Glass-transition Tg | 120 – 135 °C | Survives Sn-Pb wave / selective Pb-free ≤ 245 °C |
| Z-axis CTE (< Tg) | 70 – 85 ppm / °C | Punch vias ≤ 6:1 AR to avoid barrel cracks |
| Thermal conductivity | ≈ 0.30 W / m·K | Manage heat with wider traces or jumpers |
| UL-94 flame class | HB or V-0 (optional) | Specify V-0 for appliance safety |
*Always confirm the exact datasheet grade for production.
HIGHPCB is one of the largest Epoxy PCB Board and Rigid PCB manufacturing factories in China, click on the link to see more.
Why Choose FR-3?
Better bond strength vs. FR-1/2
Selective Pb-free capable
Punchable & V-scorable
Lower εr than phenolic
Moderate cost

Typical Applications
- CFL / LED driver boards up to 40 W
- Microwave-oven, dishwasher & washing-machine controllers
- Smart plugs, Wi-Fi power meters, low-cost IoT nodes
- Low-frequency audio amplifiers (≤ 80 kHz)
- Appliance keypads & capacitive touch PCBs
FR-3 Manufacturing Flow
| Step | Process Note | Key Control |
| CAM & panelisation | Punch map, impedance DRC | Min. clearance 0.25 mm |
| Die-punch / drilling | Steel-rule outline; carbide drill < 1 mm | ≤ 200 hits per bit |
| Cu imaging & etch | Dry-film 50 µm; alkaline etch | Trace / gap ≥ 0.20 mm |
| Through-hole plating | Optional – cost↑; flush rivets common | Aspect ratio ≤ 6:1 |
| Solder mask | LPI epoxy, UV cure | Opening ≥ 0.10 mm |
| Surface finish | OSP / Sn-Pb HASL (≥ 8 µm) ENIG (for selective Pb-free) | Wave dwell < 6 s @ 245 °C |
| Depanelisation | Hydraulic punch | Burr ≤ 0.05 mm |
| Electrical test | Flying-probe + 250 V HiPot | Isolation ≥ 10 MΩ |
5 | Design Guidelines (Engineer’s Cheat-Sheet)
- Layers: 1 layer is standard; simple 2-layer possible with plated vias.
- Board thickness: 1.0 – 1.6 mm (avoid < 1 mm due to warpage).
- Copper weight: 35 µm standard; 70 µm for ≥ 2 A traces (add 2 mm / A width).
- Pads & annular rings: ≥ 0.30 mm; square pads reduce peel-off.
- Thermal reliefs: 4 spokes, spoke ≥ 0.25 mm.
- Creepage / clearance: ≥ 2.5 mm for 250 V basic insulation (IEC 60335-1).
- Selective Pb-free: Keep peak ≤ 245 °C, dwell ≤ 10 s; use BiSnAg paste.
Heat-Management Tip: For TO-220 regulators on FR-3, add a thick-copper jumper or external aluminium slug – k ≈ 0.30 W/m·K limits in-plane spreading.
6 | FR-3 vs. FR-1 / FR-2 / High-Tg FR-4 (Single Layer)
| Metric | FR-1 | FR-2 | FR-3 | High-Tg FR-4 |
| Relative laminate cost | 0.40 | 0.35 | 0.55 | 1.00 |
| Punchability | ★★★ | ★★★ | ★★☆ | ☆ |
| Pb-free reflow | ✖ | ✖ | ♦ (≤ 245 °C selective) | ✔ |
| Max frequency | 30 MHz | 30 MHz | 80 MHz | Multi-GHz |
| Mechanical strength | Low | Low-Medium | Medium | High |
| Flame rating | HB / V-0 | HB / V-0 | HB / V-0 | V-0 |
♦ = feasible with low-temp solder & brief dwell
Support All Types of PCB Fabrication

Why Order FR-3 PCBs from HighPCB?
- Dedicated punch & CNC lines – rapid turn on large appliance panels.
- Process-controlled Sn-Pb & low-temp Pb-free profiles – no blistering, no delam.
- 3-day prototype service (single-layer) & 7-day two-layer production.
- Add-on services: stencil, selective-solder jig, conformal coating, 100 % ICT.
Need a cost-effective epoxy board with better durability than phenolic?
Click for an instant FR-3 quotation from HighPCB and accelerate your next appliance or smart-home design to market!
FAQ
Can FR-3 PCBs support SMT?
Yes. Wave-solder or selective Pb-free ≤ 245 °C handles SOIC, SOT-23, QFPs. Avoid large BGAs; switch to FR-4 for heavy fine-pitch parts.
Is FR-3 more reliable than phenolic boards?
The epoxy binder greatly increases interlaminar adhesion and solder-mask bond, reducing delamination and pad-lift versus FR-1 / FR-2.
What is the largest FR-3 panel HighPCB can produce?
Up to 350 × 450 mm punched, or 400 × 500 mm routed, with ± 0.15 mm dimensional tolerance.
Are FR-3 laminates RoHS compliant?
All FR-3 stock at HighPCB meets RoHS 2 and REACH; halogen-free V-0 grades can be specified.










